Advanced micro-electronic assembly and packaging infrastructure CMOS, MEMS and X-Ray.
As the world of digital imaging demands real-time processes, higher resolution and more portable devices, Valtronic is answering the call with advanced electronic and sensor packaging.
An important aspect of our capabilities which benefits diagnostic imaging manufacturers is our ability to continually adapt and push the limits of electronic packaging to keep up with our customer demands. Current packaging capabilities include:
Micro-electronic and surface mount technologies
Valtronic's Roadmap is taking us to:
Interested in Sensor Assembly? Click below to download a presentation.