Advanced micro-electronic assembly and packaging infrastructure CMOS, MEMS and X-Ray.
Electronic and Sensor Packaging Capabilities
As the world of digital imaging demands real-time processes, higher resolution and more portable devices, Valtronic is answering the call with advanced electronic packaging technologies.
An important aspect of our capabilities which benefits diagnostic imaging manufacturers is our ability to continually adapt and push the limits of electronic packaging to keep up with our customer demands. Current packaging capabilities include:
Micro-electronic and surface mount technologies
Flip-Chip Soldered Flip Chip - Pitch down to 200µm, Accuracy: 15µm @ 3s
Glued Flip Chip - Stud bump pitches down to <100µm (on single-sided flex circuit) precision: +/- 5µm normal, +/- 1µm high
55 micron wire bonding density and heavy wire bonding to 500 um diameter
Multi-layer flex/rigid flex circuits with vias, spaces and traces under 25 µm
SMT - fine pitch down to 01005 components (tin lead and lead-free)
Valtronic's Roadmap is taking us to:
Flip-Chip pitches below 100-microns (80-micron by year 2012)
Printed Circuit Boards with less than 25-micron spaces and traces
High Speed Flip-Chip automation equipment
Our electronic miniaturization design & manufacturing processes have been applied to:
Digital X-Ray Detectors - Chip-on-Board, Chip-on-Flex
Portable Ultrasound Imager - High Density Flip-Chip Operation
We are a niche “mechatronics” manufacturing solutions company. We produce integrated electronic and mechanical products. Our customers are leading global suppliers of medical implants and devices, diagnostic imaging equipment and sensitive aerospace and industrial assemblies. For over 30 years we have helped hundreds of companies develop and produce Class II & III medical devices and advanced miniaturized electronic assemblies from our worldwide facilities.