Your EMS Partner dedicated to medical devices
Contract Design Manufacturing (CDM)
from Design & Development
to Industrialization & Manufacturing.
Scope of Expertise
Miniaturization & Downsizing
Combining several assembly and packaging technologies, Valtronic helps you meet the challenge of integrating more functionalities into always thinner and smaller devices.
Complex Turn-key Medical Devices
From feasibility study and R&D to industrialization and manufacturing, Valtronic provides complete turnkey manufacturing solutions for Class I, Class II and Class III medical devices.
Microelectronic Assembly
Bare die, Wire bonding, Chip on Board (CoB), Chip on Chip (CoC), Flip Chip (FC), SMD, BGA, MCM, CSP, 3D CB, and 3D Die stacking are technologies which enable significant size reductions over conventional technologies.
Your Benefits
Our experts work with your objectives in mind, which results in customized solutions with strong benefits.
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